Die 100 am häufigsten verwendeten Wörter in diesem Buch.
100
above
anodic
anodization
applied
area
becomes
below
between
bias
bulk
carriers
case
cell
charge
chemical
cm
concentration
conditions
constant
contact
crystal
current
decrease
density
dependence
different
diffusion
discussed
dissolution
doped
doping
during
effect
electrochemical
electrode
electrolyte
electron
energy
etch
etching
example
fig
film
formation
formed
found
growth
hf
high
holes
however
illumination
increase
interface
jps
layer
low
macropore
may
measurements
micro
model
nm
observed
order
oxidation
oxide
pl
pore
porosity
porous
potential
present
process
properties
ps
rate
reaction
regime
sample
section
shown
shows
si
silicon
size
solutions
structure
substrate
surface
temperature
therefore
thickness
tip
two
used
values
wafer
walls